Franklin

Proceedings / IEEE Multi-Chip Module Conference MCMC- ...

Other Title:
MCMC
Publication:
Washington : IEEE Computer Society Press, 1992-1997.
Conference Name:
IEEE Multi-Chip Module Conference.
Format/Description:
Conference/Event
Journal/Periodical
6 v. : ill. ; 28 cm.
Annual
1992-1997.
Continued By:
IEEE Symposium on IC/Package Design Integration. Proceedings
Subjects:
Microelectronic packaging -- Congresses.
Electronic packaging -- Congresses.
Notes:
Conference for 1992- sponsored by: IEEE Circuits and Systems Society; IEEE Components, Hybrids, and Manufacturing Technology Society; IEEE Computer Society; IEEE Electron Devices Society.
Contributor:
IEEE Circuits and Systems Society.
IEEE Computer Society.
IEEE Components, Hybrids, and Manufacturing Technology Society.
IEEE Electron Devices Society.
OCLC:
26348998
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