Franklin

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / John H. Lau, Yi-hsin Pao.

Author/Creator:
Lau, John H.
Publication:
New York : McGraw-Hill, c1997.
Series:
Electronic packaging and interconnection series
Format/Description:
Book
xxi, 408 p. : ill. ; 24 cm.
Subjects:
Microelectronic packaging -- Reliability.
Solder and soldering -- Testing.
Multichip modules (Microelectronics) -- Testing.
Notes:
Includes bibliographical references and index.
Contributor:
Pao, Yi-hsin.
ISBN:
0070366489 (hc : acid-free paper)
OCLC:
35043085
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