Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / John H. Lau, Yi-hsin Pao.

Author/Creator:

Lau, John H.

Publication:

New York : McGraw-Hill, c1997.

Series:

Electronic packaging and interconnection series

Format/Description:

Book
xxi, 408 p. : ill. ; 24 cm.

Subjects:

Microelectronic packaging -- Reliability.
Solder and soldering -- Testing.
Multichip modules (Microelectronics) -- Testing.

Notes:

Includes bibliographical references and index.

Contributor:

Pao, Yi-hsin.

ISBN:

0070366489 (hc : acid-free paper)

OCLC:

35043085

Online:

Online access from HathiTrust during COVID-19 — only for students, active faculty, and permanent staff
http://catalog.hathitrust.org/api/volumes/oclc/35043085.html

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