Franklin

Proceedings / IEEE Symposium on IC/Package Design Integration.

Publication:
Los Alamitos, Calif. : IEEE Computer Society, 1998-
Conference Name:
IEEE Symposium on IC/Package Design Integration.
Format/Description:
Conference/Event
Journal/Periodical
v. : ill. ; 28 cm.
Annual
1998-
Continues:
IEEE Multi-Chip Module Conference. Proceedings
Subjects:
Integrated circuits -- Congresses.
Electronic packaging -- Congresses.
Microelectronic packaging -- Congresses.
Notes:
Symposium for 1998- sponsored by IEEE Computer Society, Circuits and Systems Society, Components, Packaging and Manufacturing Technology Society, Solid State Circuits Society.
Contributor:
IEEE Computer Society.
IEEE Circuits and Systems Society.
Components, Packaging & Manufacturing Technology Society.
IEEE Solid-State Circuits Society.
OCLC:
39166290
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