Franklin

Chip scale package (CSP) : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee.

Author/Creator:
Lau, John H.
Publication:
New York : McGraw-Hill, c1999.
Format/Description:
Book
xxii, 564 p. : ill. ; 24 cm.
Series:
Electronic packaging and interconnection series
Status/Location:
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Details

Subjects:
Integrated circuits -- Design and construction.
Microelectronic packaging.
Notes:
Includes bibliographical references and index.
Contributor:
Lee, Shi-Wei Ricky.
ISBN:
0070383049
OCLC:
40453052