Franklin

Stress-induced phenomena in metallization [electronic resource] : Ninth international workshop on stress-induced phenomena in metallization : Kyoto, Japan 4-6 April 2007 / editors, Shinichi Ogawa, Paul S. Ho, Ehrenfried Zschech ; sponsoring organization, Japan Society of Applied Physics.

Publication:
Melville, N.Y. : American Institute of Physics, ; 2007.
Format/Description:
Conference/Event
Book
vii, 204 p. : ill. (some col.).
Conference Name:
International Workshop on Stress-Induced Phenomena in Metallization (9th : 2007 : Kyoto, Japan)
Series:
AIP conference proceedings; v. 945.
AIP conference proceedings ; v. 945

Options
Location Notes Your Loan Policy

Details

Other Title:
Ninth International Workshop on Stress-Induced Phenomena in Metallization
International Workshop on Stress-Induced Phenomena in Metallization
Subjects:
Interconnects (Integrated circuit technology) -- Defects -- Congresses.
Metal-metal bonds -- Congresses.
Strength of materials -- Congresses.
Nanostructured materials -- Congresses.
Semiconductors -- Congresses.
Copper -- Electric properties -- Congresses.
System Details:
Mode of access: World Wide Web.
Notes:
Title from PDF title page (viewed Apr. 20, 2008).
Includes bibliographical references and indexes.
Contributor:
Ogawa, Shinichi.
Ho, Paul S.
Zschech, Ehrenfried.
Ōyō Butsuri Gakkai.
ISBN:
9780735404595
0735404593
OCLC:
182554626
Access Restriction:
Restricted for use by site license.