Stress-induced phenomena in metallization [electronic resource] : Ninth international workshop on stress-induced phenomena in metallization : Kyoto, Japan 4-6 April 2007 / editors, Shinichi Ogawa, Paul S. Ho, Ehrenfried Zschech ; sponsoring organization, Japan Society of Applied Physics.
- Publication:
- Melville, N.Y. : American Institute of Physics, ; 2007.
- Format/Description:
- Conference/Event
Book
vii, 204 p. : ill. (some col.). - Conference Name:
- International Workshop on Stress-Induced Phenomena in Metallization (9th : 2007 : Kyoto, Japan)
- Series:
- AIP conference proceedings; v. 945.
AIP conference proceedings ; v. 945 - Online:
- Connect to full text.
http://hdl.library.upenn.edu/1017.12/366911
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Details
- Other Title:
- Ninth International Workshop on Stress-Induced Phenomena in Metallization
International Workshop on Stress-Induced Phenomena in Metallization - Subjects:
- Interconnects (Integrated circuit technology) -- Defects -- Congresses.
Metal-metal bonds -- Congresses.
Strength of materials -- Congresses.
Nanostructured materials -- Congresses.
Semiconductors -- Congresses.
Copper -- Electric properties -- Congresses. - System Details:
- Mode of access: World Wide Web.
- Notes:
- Title from PDF title page (viewed Apr. 20, 2008).
Includes bibliographical references and indexes. - Contributor:
- Ogawa, Shinichi.
Ho, Paul S.
Zschech, Ehrenfried.
Ōyō Butsuri Gakkai. - ISBN:
- 9780735404595
0735404593 - OCLC:
- 182554626
- Web link:
- Publisher description
- Access Restriction:
- Restricted for use by site license.