Franklin

Collection of papers presented at the 14th International Workshop on Thermal Investigation of ICs and Systems [electronic resource] : Rome, Italy, 24-26 September 2008 / sponsored by CMP, IEEE, CPMT.

Other Title:
14th International Workshop on THERMal INvestigation of ICs and Systems
Available from some providers with title: Thermal Inveatigation [sic] of ICs and Systems, 2008, THERMINIC 2008, 14th International Workshop on
Thermal Investigation of ICs and Systems, 2008, THERMINIC 2008, 14th International Workshop on
THERMINIC 2008
Publication:
[Piscataway, N.J.] : IEEE, ©2008.
Conference Name:
International Workshop on Thermal Investigations of ICs and Microstructures (14th : 2008 : Rome, Italy)
Format/Description:
Conference/Event
Book
1 online resource : illustrations
Subjects:
Microelectronics -- Materials -- Thermal properties -- Congresses.
Notes:
Title from PDF title page (IEEE Xplore, viewed on Jan. 8, 2009).
Includes bibliographical references and author index.
Contributor:
IEEE Xplore (Online service)
CMP (Firm)
Institute of Electrical and Electronics Engineers.
Components, Packaging & Manufacturing Technology Society.
ISBN:
9781424433650
1424433657
9782355000089
2355000085
OCLC:
297464796
Access Restriction:
Restricted for use by site license.
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