Franklin

2008 Electrical Design of Advanced Packaging and Systems Symposium [electronic resource] : IEEE EDAPS 2008 : December 10-12, 2008 Seoul, Korea / sponsor, IEEE Components, Packaging, and Manufacturing Technology Society (CPMT) ; technical co-sponsor, the Korean Institute of Electromagnetic Engineering and Science (KIEES).

Other Title:
IEEE EDAPS 2008
Available from some providers with title: Advanced Packaging and Systems Symposium, 2008, EDAPS 2008, Electrical Design of
Publication:
Piscataway, NJ : IEEE, c2008.
Conference Name:
Electrical Design of Advanced Packaging and Systems Symposium (2008 : Seoul, Korea)
Format/Description:
Conference/Event
Book
1 online resource : illustrations
Subjects:
Electronic packaging -- Congresses.
Signal integrity (Electronics) -- Congresses.
Electromagnetic interference -- Congresses.
Integrated passive components -- Congresses.
Electromagnetic interference.
Electronic packaging.
Integrated passive components.
Signal integrity (Electronics)
Form/Genre:
Conference papers and proceedings.
Notes:
Title from PDF t.p. (IEEE Xplore, viewed Oct. 20, 2009).
Includes bibliographical references.
IEEE catalog number: CFP08EDP-PRT.
Contributor:
IEEE Xplore (Online service)
Components, Packaging & Manufacturing Technology Society.
Han'guk Chŏnjap'a Hakhoe.
Other format:
Print version:
ISBN:
9781424426331
1424426332
9781424426348
OCLC:
457305050
Access Restriction:
Restricted for use by site license.
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