Franklin

2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS : 9-11 April 2008.

Publication:
New York : IEEE, 2009.
Conference Name:
Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS (2008 : Nice, France)
Format/Description:
Conference/Event
Book
1 online resource (392 pages)
Subjects:
Microelectronic packaging -- Congresses.
Microelectromechanical systems -- Congresses.
Micromachining -- Congresses.
Notes:
Includes index.
Description based on: online resource; title from title screen (IEEE Xplore Digital Library, viewed March 6, 2018).
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