Franklin

Proceedings of technical papers.

Publication:
Piscataway, NJ : Institute of Electrical and Electronics Engineers
Conference Name:
International Microsystems, Packaging, Assembly, and Circuits Technology Conference.
Format/Description:
Conference/Event
Journal/Periodical
Annual
Began with 2007.
Subjects:
Microelectronic packaging -- Congresses.
Electronic packaging -- Congresses.
Microelectronics -- Congresses.
Electronic packaging.
Microelectronic packaging.
Microelectronics.
Form/Genre:
Conference papers and proceedings.
Notes:
Published by Institute of Electrical and Electronics Engineers in association with individual conference organizations.
Description based on print version record.
Contributor:
Institute of Electrical and Electronics Engineers.
ISSN:
2162-0334
OCLC:
430058414
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