EMPC 2017 : proceedings of the 21st European Microelectronics Packaging Conference :10-13 September 2017, Warsaw, Poland / Institute of Electrical and Electronics Engineers.
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2018.
- Conference Name:
- European Microelectronics and Packaging Conference (21st : 2017 : Warsaw, Poland)
1 online resource (828 pages)
- Electronic packaging -- Congresses.
Microelectronics -- Congresses.
- Electronic books.
- Description based on: online resource; title from pdf title page (IEEE Xplore, viewed March 19, 2020).
- Institute of Electrical and Electronics Engineers, sponsoring body.
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