Franklin

EMPC 2017 : proceedings of the 21st European Microelectronics Packaging Conference :10-13 September 2017, Warsaw, Poland / Institute of Electrical and Electronics Engineers.

Publication:
Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2018.
Conference Name:
European Microelectronics and Packaging Conference (21st : 2017 : Warsaw, Poland)
Format/Description:
Conference/Event
Book
1 online resource (828 pages)
Subjects:
Electronic packaging -- Congresses.
Microelectronics -- Congresses.
Form/Genre:
Electronic books.
Notes:
Description based on: online resource; title from pdf title page (IEEE Xplore, viewed March 19, 2020).
Contributor:
Institute of Electrical and Electronics Engineers, sponsoring body.
ISBN:
0-9568086-4-6
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