Franklin

Materials science of microelectromechanical systems (MEMS) devices II : symposium held November 29-December 1, 1999, Boston, Massachusetts, U.S.A. / editors, Maarten P. de Boer ... [et al.]. [electronic resource]

Publication:
Warrendale, Pa. : Materials Research Society, c2000.
Series:
Materials Research Society symposia proceedings ; v. 605.
Materials Research Society symposium proceedings ; v. 605
Format/Description:
Book
1 online resource (xiii, 314 p. ) ill. ;
Subjects:
Microelectromechanical systems -- Congresses.
Microelectronics -- Materials -- Congresses.
Microactuators -- Materials -- Congresses.
Form/Genre:
Boston (Mass., 1999)
Electronic books
Contents:
Deposition and Characterization of Si
Built-In Strain in Polysilicon: Measurement and Application to Sensor Fabrication / H. Guckel 3
Microinstrument for the Characterization of Submicron Silicon Fibers at High Strain / J.M. Chen, B.W. Reed, N.C. MacDonald 13
Testing of Critical Features of Polysilicon MEMS / D.A. LaVan, T.E. Buchheit 19
Wafer-Level Strength and Fracture Toughness Testing of Surface-Micromachined MEMS Devices / H. Kahn, N. Tayebi, R. Ballarini, R.L. Mullen, A.H. Heuer 25
Deposition and Characterization of In Situ Boron Doped Polycrystalline Silicon Films for Microelectromechanical Systems Applications / J.J. McMahon, J.M. Melzak, C.A. Zorman, J. Chung, M. Mehregany 31
Control of Residual Stresses in As-Grown Polysilicon by Multi-Layer Deposition: The "Multipoly" Process / Jie Yang, H. Kahn, A.Q. He, S.M. Phillips, A.H. Heuer 37
High-Resolution Measurement of Crack Growth in Micro-Machined Crystal Silicon /
A.M. Fitzgerald, R.H. Dauskardt, T.W. Kenny 43
Properties of Low Residual Stress Silicon Oxynitrides Used as a Sacrificial Layer / S. Habermehl, A.K. Glenzinski, W.M. Halliburton, J.J. Sniegowski 49
New Materials and Processes for Mems
New Materials and New Processes for MEMS Applications / J.-A. Schweitz, K. Larsson, G. Thornell, H. Bjorkman, F. Nikolajeff 57
Two- and Three-Dimensional Ultrananocrystalline Diamond (UNCD) Structures for a High Resolution Diamond-Based MEMS Technology / O. Auciello, A.R. Krauss, D.M. Gruen, E.M. Meyer, H.G. Busmann, J. Tucek, A. Sumant, A. Jayatissa, N. Moldovan, D.C. Mancini, M.N. Gardos 73
Maskless Patterning and Structuring on Ultra-Hard Film Materials / J.K. Park, V.M. Ayres, J. Asmussen, K. Mukherjee 79
Inlayed "Atom"-like Three-Dimensional Photonic Crystal Structures Created with Femtosecond Laser Microfabrication /
Hong-Bo Sun, Ying Xu, Kai Sun, Saulius Juodkazis, Mitsuru Watanabe, Shigeki Matsuo, Hiroaki Misawa, Junji Nishii 85
SU-8 Processing on a Variety of Substrates / Yuh-Min Chiang, Mark Bachman, Hung-Pin Chang, Charles Chu, G.P. Li 91
Characterization of Metallized Plastic MEMS / Charles Chu, Mark Bachman, Yuh-Min Chiang, Fernando Gonzales, G.P. Li 97
Tribology
Suppression of Stiction in MEMS / C.H. Mastrangelo 105
Investigation of Wear of Microelectromechanical Contacts / Brian J. Gally, C. Cameron Abnet, Stuart Brown 117
Investigation of the Deposition and Integration of Hard Coatings for Moving MEMS Applications / P.M. Adams, R.E. Robertson, R.C. Cole, D. Hinkley, G. Radhakrishnan 123
Friction Measurement in MEMS Using a New Test Structure / B.T. Crozier, M.P. de Boer, J.M. Redmond, D.F. Bahr, T.A. Michalske 129
Selective W for Coating and Releasing MEMS Devices /
S.S. Mani, J.G. Fleming, J.J. Sniegowski, M.P. de Boer, L.W. Irwin, J.A. Walraven, D.M. Tanner, D.A. LaVan 135
A Novel Integrated MEMS Process Using Fluorocarbon Films Deposited With a Deep Reactive Ion Etching (DRIE) Tool / A.A. Ayon, D-Z. Chen, R. Khanna, R. Braff, H.H. Sawin, M.A. Schmidt 141
Dynamic Optical Characterization
Computer Microvision for MEMS / Dennis M. Freeman 151
Dynamics of MEMS Microengines Using Optoelectronic Laser Interferometry / G.C. Brown, R.J. Pryputniewicz, M.P. de Boer, Norman Smith 163
Packaging
Characterization of Low Temperature, Wafer-Level Gold-Gold Thermocompression Bonds / Christine H. Tsau, Martin A. Schmidt, S. Mark Spearing 171
Packaging MEM Sensor Arrays / T.F. Marinis, D.A. Fulginiti, H.G. Clausen 177
Fluxless Microjoining by Au-In-Ni Isothermal Solidification / M. Waelti, N. Schneeberger, O. Brand, H. Baltes 183
Liga
MEMS Material Microstructure and Elastic Property Modeling / Howard R. Last, Kevin J. Hemker, Ronald Witt 191
Effect of As-Processed and Annealed Microstructures on the Mechanical Properties of LIGA Ni MEMS / Z.L. Xie, D. Pan, H. Last, K.J. Hemker 197
l Materials Aspects, Modeling and Characterization of MEMS Devices and Test Structures
Torsional Micromirror Array Design for Optical Binary Switching and Amplitude Modulation Applications / E.S. Kolesar, P.B. Allen, N.C. Boydston, J.T. Howard, S.Y. Ko, J.W. Wilken 205
Micromachined Polysilicon Resonating Xylophone Bar Magnetometer: Resonance Characteristics / J.L. Lamb, D.K. Wickenden, J.L. Champion, R.B. Givens, R. Osiander, T.J. Kistenmacher 211
Development of a MEMS Xylophone Bar Magnetometer Using Optical Interferometry for Detection / Joseph Miragliotta, R. Osiander, J.L. Champion, D.A. Oursler, T.J. Kistenmacher 217
Static and Dynamic Characterization of Buckled Composite SiO[subscript 2]-Au Microbridges / L. Nicu, C. Gergaud, A. Martinez, P. Temple-Boyer 223
Mechanical Property Measurement of Electroplated Gold Microstructure Using Resonance Method / Chang-Wook Baek, Yong-Kweon Kim, Yoo-Min Ahn 229
Temperature-Dependent Coefficient of Thermal Expansion of Silicon Nitride Films Used in Microelectromechanical Systems / Melissa Bargmann, Amy Kumpel, Haruna Tada, Patricia Nieva, Paul Zavracky, Ioannis N. Miaoulis, Peter Y. Wong 235
Fatigue Testing Machine of Micro-Sized Specimens for MEMS Applications / Y. Higo, K. Takashima, M. Shimojo, S. Sugiura, B. Pfister, M.V. Swain 241
Fatigue Properties for Micro-Sized Ni-P Amorphous Alloy Specimens / S. Maekawa, K. Takashima, M. Shimojo, Y. Higo, M.V. Swain 247
Test Channels for Flow Characterization of Processed Plastic Microchannels /
Yandong Chen, Zhongping Chen, Yonghua Zhao, J. Stuart Nelson, Mark Bachman, Yuh-Min Chiang, Charles Chu, G.P. Li 253
X-ray Microprobe Studies of Materials Problems Related to Microelectromechanical Systems (MEMS) Structures / N. Molders, P.J. Schilling, J. Gottert, H.O. Moser, V. Saile 261
Effect of Buffer Electrodes in Crystallization of Zinc Oxide Thin Film for Thin Film Bulk Acoustic Wave Resonator / Y. Yoshino, N. Tsukai, K. Inoue, M. Takeuchi, T. Nomura, T. Makino, S. Arai, T. Hata 267
Fracture Behavior of Micro-Sized Ni-P Amorphous Alloy Specimens / Y. Ichikawa, S. Maekawa, K. Takashima, M. Shimojo, Y. Higo, M.V. Swain 273
Characterization of Mems Processing
Porous Silicon as a Sacrificial Material for Microstructures Fabrication / M. Morel, M. Le Berre, V. Lysenko, G. Delhomme, A. Dittmar, D. Barbier 281
Study of PZT Film Stress in Multilayer Structures for MEMS Devices /
E. Zakar, M. Dubey, R. Polcawich, B. Piekarski, R. Piekarz, J. Conrad, R. Widuta 287
Etch Rate Variations of p[superscript +] Silicon Wafers in Aqueous KOH Solutions as a Function of Processing Conditions / P. Kilpinen, E. Maimi, V.K. Lindroos 293
Defining Conditions for the Etching of Silicon in an Inductive Coupled Plasma Reactor / H. Ashraf, J.K. Bhardwaj, E. Guibarra, S. Hall, J. Hopkins, A.M. Hynes, I. Johnston, L. Lea, S. McCauley, G. Nicholls, P. O'Brien 299
Roughness Characterization of Si(110) Etched in TMAH by Atomic Force Microscopy / Z. Moktadir, K. Sato, A. Matsumuro, K. Kayukawa, M. Shikida 305.
Notes:
Includes bibliographical references and index.
Contributor:
De Boer, Maarten.
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