Franklin

MLA

Interconnect Challenges for Cmos Technology--materials, Processes and Reliability for Downscaling, Packaging and 3d Stacking. Cambridge University Press, .

APA

Interconnect challenges for CMOS technology--materials, processes and reliability for downscaling, packaging and 3D stacking. Cambridge University Press.

Chicago

Interconnect Challenges for CMOS Technology--Materials, Processes and Reliability for Downscaling, Packaging and 3D Stacking. : Cambridge University Press.